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Library | Materyal Türü | Barkod | Yer Numarası | Durum |
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Özet
Özet
"Materials Science in Manufacturing" focuses on materials science and materials processing primarily for engineering and technology students preparing for careers in manufacturing. The text also serves as a useful reference on materials science for the practitioner engaged in manufacturing as well as the beginning graduate student.Integrates theoretical understanding and current practices to provide a resource for students preparing for advanced study or career in industry. Also serves as a useful resource to the practitioner who works with diverse materials and processes, but is not a specialist in materials science. This book covers a wider range of materials and processes than is customary in the elementary materials science books.This book covers a wider range of materials and processes than is customary in the elementary materials science books.
Author Notes
Rajiv Asthana, Ph.D., FASM, is Fulton and Edna Holtby Endowed Chair in manufacturing at the University of Wisconsin-Stout where he teaches in the manufacturing engineering program. He is Editor of Journal of Materials Engineering & Performance and on the editorial boards of Ceramics International and Materials Science and Engineering A. He has authored or coauthored five books, including Materials Science in Manufacturing (Elsevier) and 160 scientific publications, and co-edited Ceramic Integration and Joining Technologies (Wiley). His research interests include ceramic/metal joining, high-temperature capillarity and cast metal-matrix composites.
Table of Contents
| 1 Materials Behavior | p. 1 |
| Introduction | p. 1 |
| Process Innovation as Driver of Technological Growth | p. 2 |
| Single-Crystal Turbine Blades | p. 2 |
| Copper Interconnects for Microelectronic Packages | p. 2 |
| Tungsten Filament for Light Bulbs | p. 3 |
| Tailor-Welded Blanks | p. 3 |
| Atomic Bonding in Materials | p. 4 |
| Crystal Structure | p. 6 |
| Defects in Crystalline Solids | p. 10 |
| Annealing | p. 14 |
| Diffusion in Crystalline Solids | p. 17 |
| Mechanical Behavior | p. 21 |
| Strengthening of Metals | p. 26 |
| Fracture Mechanics | p. 27 |
| Fatigue | p. 31 |
| Creep | p. 34 |
| Deformation Processing | p. 35 |
| Heat Treatment | p. 35 |
| Precipitation Hardening | p. 44 |
| Thermal Properties | p. 45 |
| Electrical Properties | p. 48 |
| Dielectric and Magnetic Properties | p. 50 |
| Optical Properties | p. 52 |
| 2 Casting and Solidification | p. 57 |
| Casting Techniques | p. 57 |
| Expendable-Mold Casting | p. 58 |
| Green Sand Casting | p. 58 |
| Thermal Considerations | p. 65 |
| Dry Sand and Skin-Dried Molds | p. 69 |
| Sodium Silicate-CO[subscript 2] Process | p. 69 |
| Vacuum Molding | p. 70 |
| Shell-Molding | p. 71 |
| Investment Casting | p. 72 |
| Lost-Foam Casting | p. 74 |
| Other Expendable Mold Processes | p. 75 |
| Multiple-Use Mold Casting | p. 75 |
| Permanent Mold Casting | p. 75 |
| Die Casting and Semisolid Casting | p. 77 |
| Squeeze Casting | p. 83 |
| Centrifugal Casting | p. 86 |
| Continuous Casting | p. 86 |
| Single-Crystal Casting and Directionally Solidified Structure | p. 86 |
| Fluidity | p. 95 |
| Melt Treatments | p. 98 |
| Metallic Foams and Gasars | p. 100 |
| Melting Furnaces | p. 102 |
| Mold-Filling Time | p. 102 |
| Gate and Runner Area Calculation | p. 105 |
| Temperature Drop in Metal Flow | p. 106 |
| Riser Design | p. 111 |
| Naval Research Lab Method | p. 113 |
| Riser Size Estimation Using Chvorinov's Rule | p. 116 |
| Solidification Rate | p. 119 |
| Sand Mold | p. 119 |
| Die Casting | p. 122 |
| Stages of Solidification-Nucleation and Growth | p. 125 |
| Nucleation | p. 125 |
| Homogeneous Nucleation | p. 126 |
| Heterogeneous Nucleation | p. 130 |
| Nucleation and Grain Refinement | p. 133 |
| Growth During Solidification | p. 134 |
| Atomic Structure at the Solidification Interface | p. 134 |
| Growth in Pure Metals | p. 137 |
| Growth of Single-Phase Alloys | p. 139 |
| Constitutional Supercooling and Interface Instability | p. 142 |
| Eutectic Solidification | p. 146 |
| Solidification of Industrial Castings | p. 149 |
| Grain Structure | p. 149 |
| Segregation | p. 151 |
| Constrained Solidification in Small Regions | p. 153 |
| Rapid Solidification and Metallic Glass | p. 157 |
| Weld Solidification | p. 158 |
| Solidification Under Reduced Gravity | p. 160 |
| Interactions of Solidification Front with Insoluble Particles | p. 162 |
| 3 Powder Metallurgy and Ceramic Forming | p. 167 |
| Crystalline Ceramics and Glasses | p. 167 |
| Powder Metallurgy | p. 172 |
| Powder Production | p. 172 |
| Solidification of Atomized Droplets | p. 174 |
| Other Methods of Powder Manufacture | p. 176 |
| Particle Size and Shape | p. 177 |
| Powder Mixing | p. 179 |
| Powder Compaction | p. 180 |
| Dynamics of Powder Densification | p. 181 |
| Isostatic Compaction and Hot Isostatic Compaction (HIP) | p. 185 |
| Analysis of Pressure Distribution in Uniaxial Compaction | p. 185 |
| Pressure Distribution in an Annular Cylinder | p. 187 |
| Powder Injection-Molding (PIM) | p. 188 |
| Rheological Considerations in Powder Injection-Molding | p. 191 |
| Settling and Segregation in Powder Injection-Molding Slurries | p. 195 |
| Sintering | p. 197 |
| Mechanism of Sintering | p. 198 |
| Other Considerations in Sintering | p. 203 |
| Homogenization | p. 203 |
| Coarsening | p. 205 |
| Ceramic Forming | p. 207 |
| Slip-Casting | p. 207 |
| Tape-Casting | p. 213 |
| Ceramic Extrusion | p. 215 |
| Electrolytic and Electrophoretic Deposition | p. 216 |
| Glass Forming | p. 220 |
| Pore Characterization | p. 224 |
| Properties of Ceramics | p. 227 |
| Mechanical Properties | p. 227 |
| Thermal Properties | p. 232 |
| Electrical and Electronic Properties | p. 235 |
| Oxidation and Corrosion Resistance | p. 237 |
| Bioceramics and Porous Ceramic Foams | p. 240 |
| Joining of Ceramics | p. 241 |
| 4 Surface, Subsurface, and Interface Phenomena | p. 247 |
| Surface Forces | p. 248 |
| Electrostatic Forces | p. 248 |
| Van der Waals Forces | p. 250 |
| Contact Angle, Surface Tension, and Young's Equation | p. 251 |
| Grain Boundaries in Polycrystals | p. 254 |
| Three-Phase Equilibrium | p. 255 |
| Microscopic Angles and Precursor Film | p. 257 |
| Roughness and Chemical Inhomogeneity | p. 257 |
| Dynamic Contact Angles | p. 260 |
| Immersion of Solids in Liquids | p. 264 |
| Gas-Solid Attachment and Gas Stabilization | p. 268 |
| Agglomeration | p. 268 |
| Capillary Flow | p. 273 |
| Capillary Pressure | p. 273 |
| Capillary Rise | p. 275 |
| Wettability and Capillary Rise at High Temperatures | p. 280 |
| Effect of Oxide on Liquid | p. 280 |
| Alloying and Surface Coatings | p. 282 |
| Reactive Infiltration | p. 283 |
| Reactive Penetration | p. 285 |
| Capillary Flow with Unsteady Contact Angle and Pore Size | p. 286 |
| Joining | p. 289 |
| Adhesion | p. 296 |
| Capillarity in Miscellaneous Other Processes | p. 298 |
| Wear, Friction, and Lubrication | p. 301 |
| Corrosion | p. 307 |
| 5 Coatings and Surface Engineering | p. 313 |
| Design and Development of Coatings | p. 313 |
| Surface Pretreatments | p. 314 |
| Coating Techniques | p. 316 |
| Vapor-Phase Deposition | p. 316 |
| Nucleation and Growth in Vapor Condensation | p. 320 |
| Ion-Nitriding | p. 324 |
| Thermal Spray-Coating | p. 325 |
| Physical Considerations in Thermal Spraying | p. 326 |
| Structure, Properties, and Applications of Thermal Spray Coatings | p. 332 |
| Electroplating | p. 338 |
| Physical Considerations | p. 338 |
| Plating Practice | p. 339 |
| Electroless Plating | p. 343 |
| Anodizing | p. 345 |
| Coatings on Powders and Fibers | p. 348 |
| Organic Coatings-Paints and Powders | p. 348 |
| Powder Coatings | p. 351 |
| Electrostatic Powder Spray | p. 351 |
| Electrocoating | p. 352 |
| Conversion Coatings | p. 353 |
| Vitreous Ceramic Coatings | p. 353 |
| Surface Hardening | p. 355 |
| Selective Hardening | p. 355 |
| Diffusion Hardening | p. 357 |
| Laser Surface-Engineering | p. 361 |
| Laser-Materials Interaction | p. 361 |
| Types of Lasers | p. 362 |
| Lasers as Surface-Engineering Tools | p. 363 |
| Characteristics of Laser Surface Engineering | p. 364 |
| Laser Surface Heating | p. 368 |
| Laser Surface Melting | p. 372 |
| Solidification Structure | p. 374 |
| Laser Surface Alloying | p. 377 |
| Laser-Induced Ceramic Coating | p. 381 |
| Laser-Cladding | p. 382 |
| Laser-Induced Combustion Synthesis | p. 387 |
| Laser Surface-Vaporization | p. 387 |
| Laser Surface-Texturing | p. 388 |
| Laser Surface Cleaning | p. 390 |
| Laser Surface-Marking | p. 391 |
| Laser Surface-Shocking | p. 391 |
| Miscellaneous Laser Processes | p. 391 |
| Residual Stress State of Laser-Treated Surface | p. 392 |
| Promise of Lasers in Surface-Engineering | p. 394 |
| 6 Composite Materials | p. 397 |
| Definition and Classification | p. 397 |
| Fibers | p. 398 |
| Glass | p. 399 |
| Boron | p. 399 |
| Carbon Fiber | p. 400 |
| Organic Fibers | p. 402 |
| Metallic Fibers | p. 402 |
| Ceramic Fibers | p. 403 |
| Interface | p. 406 |
| Fiber Strengthening | p. 409 |
| Polymer-Matrix Composites | p. 410 |
| Matrix | p. 410 |
| Properties of Polymeric Matrices | p. 414 |
| Polymer Composites | p. 414 |
| Ceramic-Matrix Composites | p. 418 |
| Carbon-Carbon Composites | p. 423 |
| Chemical Vapor Infiltration | p. 425 |
| Metal-Matrix Composites | p. 429 |
| Heat-Resistant Composites | p. 429 |
| Dispersion-Strengthened Composites | p. 429 |
| In Situ Composites | p. 433 |
| Particulate and Fiber-Reinforced High-Temperature Alloys | p. 436 |
| Fabrication of Metal-Matrix Composites | p. 439 |
| Solid-State Fabrication | p. 440 |
| Liquid-State Fabrication | p. 445 |
| Infiltration | p. 445 |
| Reactive Infiltration | p. 448 |
| Stirring Techniques | p. 453 |
| Low-Cost Composites by Casting | p. 455 |
| Other Liquid-Phase Techniques | p. 457 |
| Wettability and Bonding | p. 458 |
| Ni-Base Composites | p. 458 |
| Properties | p. 460 |
| Interface Strength | p. 460 |
| Fiber Strength | p. 467 |
| Stiffness, Strength, and Ductility | p. 469 |
| Fatigue and Fracture Toughness | p. 475 |
| Other Properties | p. 476 |
| Creep | p. 476 |
| Vibration Damping | p. 477 |
| Wear and Friction | p. 477 |
| Thermal Properties | p. 480 |
| Thermal Fatigue | p. 482 |
| Oxidation Resistance | p. 483 |
| 7 Semiconductor Manufacturing | p. 485 |
| Introduction | p. 485 |
| Integrated Circuit Applications and Market | p. 485 |
| Feature Size and Wafer Size | p. 486 |
| Technology Trends | p. 489 |
| Fundamentals of Semiconductors | p. 489 |
| Crystal Structure of Silicon | p. 489 |
| Energy Band Theory | p. 493 |
| The Fermi Level | p. 495 |
| Intrinsic Semiconductor | p. 495 |
| Extrinsic Semiconductor | p. 497 |
| Dopant Concentration and Conductivity | p. 498 |
| Diodes | p. 498 |
| Bipolar Junction Transistors (BJT) | p. 500 |
| Metal Oxide Field Effect Transistors (MOSFET) | p. 503 |
| Crystal Growth and Wafer Preparation | p. 504 |
| Czokhralski Method | p. 505 |
| Floating-Zone Method | p. 506 |
| Defects | p. 507 |
| Wafer Preparation | p. 510 |
| Initial Steps | p. 510 |
| Wafer Slicing | p. 510 |
| Postslicing Polishing and Cleaning | p. 511 |
| Oxidation | p. 512 |
| Properties of Silicon Dioxide | p. 512 |
| Oxidation Techniques | p. 512 |
| Oxidation Furnaces and Factors Affecting Oxide Growth | p. 514 |
| Characterization of Oxide Films | p. 515 |
| Simulation | p. 517 |
| Diffusion | p. 517 |
| Fick's Diffusion Equations | p. 518 |
| Constant Source Diffusion | p. 519 |
| Limited Source Diffusion | p. 519 |
| Diffusion Coefficient | p. 520 |
| Concentration-Dependent Diffusion | p. 520 |
| Lateral Diffusion | p. 521 |
| Junction Depth | p. 521 |
| Sheet Resistance | p. 521 |
| Simulation | p. 522 |
| Ion Implantation | p. 522 |
| Ion Implanter | p. 522 |
| Channeling | p. 523 |
| Implantation Damage | p. 524 |
| Annealing | p. 524 |
| Rapid Thermal Annealing | p. 524 |
| Photolithography | p. 524 |
| Introduction | p. 524 |
| Optical Lithography | p. 526 |
| The Clean Room | p. 526 |
| The Pattern Transfer Process | p. 527 |
| Exposure Systems | p. 530 |
| Masks and Resists | p. 532 |
| Thin Film Deposition | p. 532 |
| Vacuum Deposition Techniques | p. 532 |
| Physical Vapor Deposition | p. 532 |
| Evaporation | p. 533 |
| Sputtering | p. 534 |
| Reactive Sputtering | p. 535 |
| Radio Frequency (RF) Sputtering | p. 535 |
| Magnetron Sputtering | p. 535 |
| Collimated Sputtering | p. 535 |
| Ionized Magnetron Sputtering | p. 536 |
| Chemical Vapor Deposition | p. 536 |
| Epitaxy | p. 537 |
| Molecular Beam Epitaxy | p. 537 |
| Nonvacuum Deposition Techniques | p. 537 |
| Chemical Bath Deposition | p. 537 |
| Spin-On Deposition | p. 538 |
| Etching | p. 538 |
| Introduction | p. 538 |
| Etching Types | p. 538 |
| Wet Etching | p. 538 |
| Dry Etching | p. 539 |
| Ion Beam Milling | p. 539 |
| Plasma Etching | p. 540 |
| Reactive Ion Etching | p. 540 |
| Metallization | p. 540 |
| Ohmic Contacts | p. 540 |
| Metals and Alloys | p. 541 |
| Junction Spiking | p. 541 |
| Electromigration | p. 542 |
| Copper Metallization | p. 542 |
| Damascene Technology | p. 543 |
| Chemical Mechanical Polishing (CMP) | p. 544 |
| Silicide | p. 544 |
| Packaging | p. 546 |
| Traditional Packaging | p. 546 |
| Advanced Packaging | p. 547 |
| Yield and Reliability | p. 548 |
| Yield | p. 548 |
| Processing Effects | p. 548 |
| Circuit Sensitivities | p. 548 |
| Point Defects | p. 549 |
| Reliability | p. 549 |
| 8 Nanomaterials and nanomanufacturing | p. 551 |
| Introduction | p. 551 |
| Nanotubes, Nanoparticles, and Nanowires | p. 552 |
| Methods Using Solid Precursors | p. 554 |
| Inert Gas Condensation | p. 554 |
| Pulsed Laser Ablation | p. 555 |
| Ion Sputtering | p. 557 |
| Methods Using Liquid or Vapor Precursor | p. 557 |
| Chemical Vapor Synthesis | p. 557 |
| Laser Pyrolysis | p. 557 |
| Synthesis of Nanoparticles by a Chemical Methods | p. 557 |
| Nanoparticles: Biomedical Applications | p. 558 |
| Tissue Engineering | p. 560 |
| Manipulation of Cells and Biomolecules | p. 561 |
| Protein Detection | p. 562 |
| Cancer Therapy | p. 562 |
| Semiconductor Nanowires | p. 563 |
| General Synthetic Strategies | p. 563 |
| Fabrication of Semiconductor Nanowires | p. 565 |
| Fabrication of Metal Nanowires | p. 569 |
| Electrochemical Fabrication of Metal Nanowires | p. 571 |
| Negative Template Methods | p. 571 |
| Anodic porous Alumina | p. 572 |
| Fabrication of Metal Nanowires | p. 573 |
| Positive Template Method | p. 575 |
| Carbon Nanotube Template | p. 575 |
| DNA Template | p. 575 |
| Polymer Templates | p. 576 |
| Applications of the Nanowires | p. 579 |
| Magnetic Materials and Devices | p. 579 |
| Optical Applications | p. 580 |
| Biological Assays | p. 580 |
| Chemical Sensors | p. 581 |
| Carbon Nanotubes | p. 581 |
| Structure of the Carbon Nanotube | p. 583 |
| Synthesis of Carbon Nanotubes | p. 585 |
| Growth Mechanisms of Carbon Nanotubes | p. 587 |
| Carbon Nanotube Composite Materials | p. 588 |
| Polymer NanoComposites | p. 590 |
| Ceramic NanoComposites | p. 591 |
| Ceramic Nanotube Composite Systems | p. 593 |
| Ceramic-Coated MWNTs and SWNTs | p. 594 |
| Conductive Ceramics | p. 595 |
| Nanostructured Metals and Metal Composites | p. 595 |
| Solid-State Powder-Based Processing | p. 596 |
| Liquid-Phase Processing | p. 597 |
| Surface, Interface, Nucleation and Reactivity | p. 599 |
| Agglomeration, Dispersion and Sedimentation | p. 601 |
| Properties | p. 602 |
| Strength and Modulus | p. 602 |
| Nanotribology | p. 603 |
| Carbon Nanotubes: Biosensor Applications | p. 603 |
| FET-Based Biosensors | p. 604 |
| Aligned Nanoelectrode Array-Based Electronic Chips | p. 605 |
| Index | p. 615 |
